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1. Selective Etching

Selective etching is a process that removing required layer and no hurt to any other layer, usually the removed layer should be at the top side, but in some situation, we could also remove the inside layer
We could do any pattern quickly, no ...

2. Laser fine cutting

* Material: any material, including all kinds of metal, alloys, and non metal material, especially hard and brittle material such as silicon, glass, sapphire, and ceramics, as well as flexible material such as PET film, flexible PCB, all kinds ...

3. Customized marking

High quality customized marking with fiber lasers, UV and ultra-fast lasers, apply to all kinds of mateiral including metals, ceramics, glass, silicon, ploymers, plastics

4. Ceramics drilling and cutting

Ceramics: Alumina, Aluminum nitride, Zirconia
Thickness: 0.1~2mm
Min feature size: 0.01mm
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD
Tolerance: 5~20um depends on dimension

5. Sapphire cutting and drilling

Material:Sapphire
Thickness: 0.1~2mm
Min feature size: 0.01mm
Could be any shapes: circles, triangle, retangle, hexagon, polygon or any shape in CAD
Tolerance: 5~20um depends on dimension